Lapping refers to the process of grinding the Si wafer surface so as to remove the damaged layer caused by slicing process and to obtain Si
Silicon Wafer Handling Wafer transfer is an important front-end process of semiconductor manufacturing equipment that, in particular, requires high precision Only a thin layer on the surface of a silicon wafer is used for making electronic components; the rest serves essentially as a mechanical support The role of
ดูบอลเชียงราย In the CZ method, a graphite crucible, a high-purity quartz crucible, and poly-crystal silicon are set in a crystal pulling apparatus They are heat-melted over Silicon wafers are the essential components of modern electronics They provide a unique combination of electrical, mechanical, and chemical qualities These
